This is an excellent option for situations where a low profile is required such as a mobile telephones or MP3 players. Using flip chip technology the controller/driver IC is bonded directly to the ITO traces on the display itself. This technology is also advantageous when handling high speed/frequency signals.


This is a popular module construction method for low to medium resolution displays including segmented glass and alphanumeric and dot matrix display modules. The controller/driver IC is directly placed onto the PCB as a naked die and subsequently wire bonded to the PCB using micro diameter gold or aluminum wires. The entire area of the bonded IC is then encapsulated using a thermosetting epoxy. The regular application is for fax machines and printers etc.

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