COB

This is a popular module construction method for low to medium resolution displays including segmented glass and alphanumeric and dot matrix display modules. The controller/driver IC is directly placed onto the PCB as a naked die and subsequently wire bonded to the PCB using micro diameter gold or aluminum wires. The entire area of the bonded IC is then encapsulated using a thermosetting epoxy. The regular application is for fax machines and printers etc.